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Fabrication and characterization of Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration
Xiao, Ming, Munief, Walid Madhat, Wu, Fengshun, Lilischkis, Rainer, Oberbillig, Tobias, Saumer, Monika, Xia, WeishengVolume:
28
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/ssmt-10-2015-0031
Date:
April, 2016
File:
PDF, 602 KB
english, 2016