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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking
Xie, Ling, Wickramanayaka, Sunil, Jung, Boo Yung, Li, Jerry Aw Jie, Jung-kai, Lim, Ismael, DanielYear:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028388
File:
PDF, 4.46 MB
english, 2014