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[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Electromigration in microbumps with Cu-Sn intermetallic compounds
Yi-Cheng Chu,, Chau-Jie Zhan,, Han-Wen Lin,, Yu-Wei Huang,, Chih Chen,Year:
2016
Language:
english
DOI:
10.1109/icep.2016.7486822
File:
PDF, 2.45 MB
english, 2016