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[IEEE 2004 IEEE International Reliability Physics Symposium. - Phoenix, AZ, USA (25-29 April 2004)] 2004 IEEE International Reliability Physics Symposium. Proceedings - Reliability and microstructure of lead-free solder die attach interface in silicon power devices
Huff, D., Katsis, D., Stinson-Bagby, K., Thacker, T., Lu, G.-Q., van Wyk, J.D.Year:
2004
Language:
english
DOI:
10.1109/relphy.2004.1315392
File:
PDF, 166 KB
english, 2004