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SPIE Proceedings [SPIE Micromachining and Microfabrication - Austin, TX (Monday 29 September 1997)] Micromachining and Microfabrication Process Technology III - IC-compatible fabrication of through-wafer conductive vias
Gobet, Jean, Thiebaud, Jean-Phillipe, Crevoisier, Francois, Moret, Jean-Marc, Chang, Shih-Chia, Pang, Stella W.Volume:
3223
Year:
1997
Language:
english
DOI:
10.1117/12.284487
File:
PDF, 1.31 MB
english, 1997