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SPIE Proceedings [SPIE International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 27 November 2000)] Microelectronic Yield, Reliability, and Advanced Packaging - Dependence of EM performance on linewidth for Cu dual-inlaid structures
Zhao, Larry, Capasso, Cristiano, Marathe, Amit P., Thrasher, Stacye R., Hernandez, Richard, Mulski, Peggy, Rose, Stewart, Nguyen, Timothy, Gall, Martin, Kawasaki, Hisao, Tan, Cher Ming, Peng, Yeng-KauVolume:
4229
Year:
2000
Language:
english
DOI:
10.1117/12.404883
File:
PDF, 1.07 MB
english, 2000