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SPIE Proceedings [SPIE Design, Process Integration, and Characterization for Microelectronics - Santa Clara, CA (Wednesday 6 March 2002)] Design, Process Integration, and Characterization for Microelectronics - GDS-3 initiative: advanced design-through-chip infrastructure for subwavelength technology
Pack, Robert C., Heins, Mitchell D., Chatila, Ahmad R., Boksha, Victor V., Cottrell, D., Berglund, C. Neil, Hogan, J., James, F., Vucurevich, T., Bales, M., Shimasaki, K., Starikov, Alexander, Tobin,Volume:
4692
Year:
2002
Language:
english
DOI:
10.1117/12.475667
File:
PDF, 1.09 MB
english, 2002