Effect of Plasma Treatments on the Interface Chemistry and...

Effect of Plasma Treatments on the Interface Chemistry and Adhesion Strength Between Cu Metallization and SiCN Etch Stop Layer

Chang, Shou-Yi, Lee, Yu-Shuien, Lu, Chia-Ling
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
154
Year:
2007
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2437050
File:
PDF, 1.32 MB
english, 2007
Conversion to is in progress
Conversion to is failed