Effect of Plasma Treatments on the Interface Chemistry and Adhesion Strength Between Cu Metallization and SiCN Etch Stop Layer
Chang, Shou-Yi, Lee, Yu-Shuien, Lu, Chia-LingVolume:
154
Year:
2007
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2437050
File:
PDF, 1.32 MB
english, 2007