Production process options for IC package wire sweep in...

Production process options for IC package wire sweep in view of the matter element theory

Lung, Ching-Yung, Chen, Shun-Hsing, Yeh, Tsu-Ming
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Volume:
10
Language:
english
Journal:
Journal of Statistics and Management Systems
DOI:
10.1080/09720510.2007.10701284
Date:
September, 2007
File:
PDF, 517 KB
english, 2007
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