Solid-liquid interdiffusion (SLID) bonding in the Au–In...

Journal of Micromechanics and Microengineering 2015 / 12 Vol. 25; Iss. 12

Solid-liquid interdiffusion (SLID) bonding in the Au–In system: experimental study and 1D modelling

Deillon, Léa, Hessler-Wyser, Aïcha, Hessler, Thierry, Rappaz, Michel
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Volume:
25
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/25/12/125016
Date:
December, 2015
File:
PDF, 1.19 MB
english, 2015
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