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Challenges in the manufacture of glass substrates for electrical and optical interconnect
Hutt, David A., Williams, Karen, Conway, Paul P., Khoshnaw, Fuad M., Cui, Xiaoyun, Bhatt, DeepaVolume:
33
Language:
english
Journal:
Circuit World
DOI:
10.1108/03056120710723689
Date:
February, 2007
File:
PDF, 504 KB
english, 2007