The impact of thermal cycling regime on the shear strength of lead‐free solder joints
Dusek, Milos, Wickham, Martin, Hunt, ChristopherVolume:
17
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910510597474
Date:
June, 2005
File:
PDF, 679 KB
english, 2005