The impact of thermal cycling regime on the shear strength...

The impact of thermal cycling regime on the shear strength of lead‐free solder joints

Dusek, Milos, Wickham, Martin, Hunt, Christopher
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Volume:
17
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910510597474
Date:
June, 2005
File:
PDF, 679 KB
english, 2005
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