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Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method
Tsai, Jinn-Tsong, Chang, Cheng-Chung, Chen, Wen-Ping, Chou, Jyh-HorngVolume:
4
Year:
2016
Language:
english
Journal:
IEEE Access
DOI:
10.1109/access.2016.2581258
File:
PDF, 641 KB
english, 2016