[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Effect of compression loads on the solder joint reliability of flip chip BGA packages
Garner, L., Zhang, C., Keh Shin Beh,, Helms, K., Yew Lip Tan,Year:
2004
Language:
english
DOI:
10.1109/ectc.2004.1319413
File:
PDF, 789 KB
english, 2004