[IEEE 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, South Korea (2015.12.14-2015.12.16)] 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Electrothermal characteristics of carbon-based through-silicon via (TSV) channel
Li, Na, Mao, Junfa, Zhao, Wen-Sheng, Yin, Wen-YanYear:
2015
Language:
english
DOI:
10.1109/edaps.2015.7383662
File:
PDF, 374 KB
english, 2015