[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Solder joint reliability with variations of solder ball land design
Young Hy Jung,Year:
2007
Language:
english
DOI:
10.1109/emap.2007.4510326
File:
PDF, 116.48 MB
english, 2007