[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Forced-time controlled transient dynamic wire bonding simulation for wire bond process development
Meng, Chai Chee, Yik, Eric Yong WoonYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412397
File:
PDF, 585 KB
english, 2015