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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Reliability test failure analysis using advance FA techniques on Cu wire bonded devices
Zhang, L., Chai, T. C., Wai, L. C., Lam, T. W., Vallett, D. P., Tang, J.Year:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412404
File:
PDF, 837 KB
english, 2015