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[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Low temperature interconnect fabrication on PDMS polymeric substrates using Ag nanoparticles and submicron particles
Sin-Yong Liang,, Yu-Siang Fang,, Po-Hao Chiang,, Jenn-Ming Song,, Lung-Tai Chen,Year:
2016
Language:
english
DOI:
10.1109/icep.2016.7486802
File:
PDF, 758 KB
english, 2016