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[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Fine line/space IC substrate made by selectively fully additive process
Shin-Hua Chao,, Chao-Fu Weng,Year:
2016
Language:
english
DOI:
10.1109/icep.2016.7486843
File:
PDF, 479 KB
english, 2016