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[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Thermal cycling lifetime estimation of sintered metal die attachment
Suzuki, Tomohisa, Yasuda, Yusuke, Terasaki, Takeshi, Morita, Toshiaki, Kawana, Yuki, Ishikawa, Dai, Nishimura, Masato, Nakako, Hideo, Kurafuchi, KazuhikoYear:
2016
Language:
english
DOI:
10.1109/icep.2016.7486856
File:
PDF, 1.10 MB
english, 2016