[IEEE 2016 International Conference on Electronics...

  • Main
  • [IEEE 2016 International Conference on...

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Thermal cycling lifetime estimation of sintered metal die attachment

Suzuki, Tomohisa, Yasuda, Yusuke, Terasaki, Takeshi, Morita, Toshiaki, Kawana, Yuki, Ishikawa, Dai, Nishimura, Masato, Nakako, Hideo, Kurafuchi, Kazuhiko
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2016
Language:
english
DOI:
10.1109/icep.2016.7486856
File:
PDF, 1.10 MB
english, 2016
Conversion to is in progress
Conversion to is failed