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[IEEE 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Grenoble, France (2015.5.18-2015.5.21)] 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Sub-90nm pitch Cu low-k interconnect etch solution using RF pulsing technology
Liao, J H, Lai, Yu Tsung, Wan, Stan, Kuo, Brandon, Gopaladasu, Prabhakara, Wei, David, Yao, Sean, Lin, Wesley, Wang, Ivan, Lin, Paul, Finch, Barrett, Deshmukh, ShashankYear:
2015
DOI:
10.1109/iitc-mam.2015.7325638
File:
PDF, 521 KB
2015