CPI Parametric Investigation of UBM-Al Interface for Cu Pillar Flip-Chip Application
Lianto, Prayudi, Li, Hong Yu, Balamurugan, R., Wei, Junqi, Jaafar, Norhanani Binte, Eva Wai, Leong Ching, Sundarrajan, ArvindYear:
2016
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2016.2571059
File:
PDF, 1.95 MB
english, 2016