SPIE Proceedings [SPIE Microelectronic Processing '93 - Monterey, CA (Sunday 26 September 1993)] Multilevel Interconnection: Issues That Impact Competitiveness - Spin on glass (SOG) etch-back planarization process: an industrial solution for 0.5-μm CMOS TLM technology
Molle, Pascale, Ullmann, H., Gros, B., Fugier, P., Demolliens, O., Hoang, Hoang H., Schutz, Ron, Bernstein, Joseph B., Vasquez, BarbaraVolume:
2090
Year:
1993
Language:
english
DOI:
10.1117/12.156515
File:
PDF, 704 KB
english, 1993