SPIE Proceedings [SPIE Microelectronic Manufacturing 1996 - Austin, TX (Wednesday 16 October 1996)] Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II - Wire length and via reduction for yield enhancement
Chiluvuri, Venkat K. R., Koren, Israel, Keshavarzi, Ali, Prasad, Sharad, Hartmann, Hans-DieterVolume:
2874
Year:
1996
Language:
english
DOI:
10.1117/12.250850
File:
PDF, 577 KB
english, 1996