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SPIE Proceedings [SPIE Design, Test, Integration, and Packaging of MEMS/MOEMS 2001 - Cannes-Mandelieu, France (Wednesday 25 April 2001)] Design, Test, Integration, and Packaging of MEMS/MOEMS 2001 - Finite element analysis to support component level fault modeling for MEMS
Reichenbach, R., Rosing, Richard, Richardson, Andrew, Dorey, A., Courtois, Bernard, Karam, Jean Michel, Levitan, Steven P., Markus, Karen W., Tay, Andrew A. O., Walker, James A.Volume:
4408
Year:
2001
Language:
english
DOI:
10.1117/12.425358
File:
PDF, 648 KB
english, 2001