![](/img/cover-not-exists.png)
SPIE Proceedings [SPIE Second International Conference on Experimental Mechanics - Singapore, Singapore (Wednesday 29 November 2000)] Second International Conference on Experimental Mechanics - Thermal deformation measurement of electronic packaging component using AFM scanning moire method
Xie, Huimin, Chai, Gin B., Asundi, Anand K., Jin, Yu, Lu, Yunguang, Ngoi, Bryan K. A., Zhong, Zhaowei, Chau, Fook S., Quan, ChenggenVolume:
4317
Year:
2001
Language:
english
DOI:
10.1117/12.429567
File:
PDF, 1.13 MB
english, 2001