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SPIE Proceedings [SPIE Third International Conference on Experimental Mechanics - Beijing, China (Thursday 14 February 2002)] Third International Conference on Experimental Mechanics - Measurement of warpage of electronic packaging after machining by phase-shifting shadow moire method
Wang, Wei-Chung, Liu, Yu-Wen, Wu, Xiaoping, Qin, Yuwen, Fang, Jing, Ke, JingtangVolume:
4537
Year:
2002
Language:
english
DOI:
10.1117/12.468812
File:
PDF, 397 KB
english, 2002