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SPIE Proceedings [SPIE SPIE Proceedings - (Sunday 12 February 2012)] - Through-hole processing of aluminum nitride and silicon wafers using short-pulse lasers
Deki, Kyoichi, Kanai, Masaki, Takizawa, Hiroyuki, Matsuoka, Fumiaki, Arisawa, Takashi, Miyamoto, Isamu, Helvajian, Henry, Itoh, Kazuyoshi, Kobayashi, Kojiro F., Ostendorf, Andreas, Sugioka, KojiYear:
2012
Language:
english
DOI:
10.1117/12.596745
File:
PDF, 467 KB
english, 2012