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High strain rate testing of solder interconnections
Bailey, Christopher, Tsai, K.T., Liu, F‐L., Wong, E.H., Rajoo, R.Volume:
18
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910610665080
Date:
April, 2006
File:
PDF, 413 KB
english, 2006