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[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Silicon Through Vias for System-on-Wafer (SoW): Technology and SiO2 Insulation Layer Characterization
Henry, D., Sillon, N., Belhachemi, D., Brunet-Manquat, C., Puget, C., Ponthenier, G.Year:
2006
Language:
english
DOI:
10.1109/estc.2006.280010
File:
PDF, 7.78 MB
english, 2006