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SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - As-deposited properties and rapid thermal annealing effects on Ti/TiN barrier layer for aluminum plug technology
Liao, De-Dui, Lin, Yih-Shung, Yang, Hong, Witham, Howard, Saenz, Javier, May, Jeff S., Lee, Jen-Jiang J., Chen, Fusen E., Murarka, Shyam P.Volume:
2335
Year:
1994
Language:
english
DOI:
10.1117/12.186056
File:
PDF, 645 KB
english, 1994