SPIE Proceedings [SPIE Microelectronic Manufacturing 1996 - Austin, TX (Wednesday 16 October 1996)] Microelectronic Device and Multilevel Interconnection Technology II - Integration of ICP high-density plasma CVD with CMP and its effects on planarity for sub-0.5-um CMOS technology
Yota, Jiro, Brongo, Maureen R., Dyer, Thomas W., Rafftesaeth, Kenneth P., Bondur, James A., Chen, Ih-Chin, Sasaki, Nobuo, Patel, Divyesh N., Dixit, Girish A.Volume:
2875
Year:
1996
Language:
english
DOI:
10.1117/12.250875
File:
PDF, 490 KB
english, 1996