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SPIE Proceedings [SPIE Microelectronic Manufacturing 1996 - Austin, TX (Wednesday 16 October 1996)] Microelectronic Device and Multilevel Interconnection Technology II - Intermetallic compound formation in hot aluminum metallization and its effect on etching and electromigration
Liu, Lianjun, Lu, Dong, Foo, Pang Dow, Tan, Way Tat, Kowk, Kurt, Zou, Gang, Tse, Man S., Chen, Ih-Chin, Sasaki, Nobuo, Patel, Divyesh N., Dixit, Girish A.Volume:
2875
Year:
1996
Language:
english
DOI:
10.1117/12.250882
File:
PDF, 1.77 MB
english, 1996