![](/img/cover-not-exists.png)
SPIE Proceedings [SPIE Microelectronic Manufacturing - Santa Clara, CA (Sunday 20 September 1998)] Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV - Influence of the material properties on the thermal behavior of a package
Weide, Kirsten, Keck, Christian, Yu, Xiaoying, Prasad, Sharad, Hartmann, Hans-Dieter, Tsujide, TohruVolume:
3510
Year:
1998
Language:
english
DOI:
10.1117/12.324388
File:
PDF, 539 KB
english, 1998