SPIE Proceedings [SPIE Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS - Paris, France (Tuesday 9 May 2000)] Design, Test, Integration, and Packaging of MEMS/MOEMS - Analysis of electromechanical parameters of electrostatic microrelay with a movable elastic cantilever electrode
Efremov, Georgy I., Mukhurov, Nikolay I., Galdetskiy, A. V., Courtois, Bernard, Crary, Selden B., Gabriel, Kaigham J., Karam, Jean Michel, Markus, Karen W., Tay, Andrew A. O.Volume:
4019
Year:
2000
Language:
english
DOI:
10.1117/12.382309
File:
PDF, 188 KB
english, 2000