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SPIE Proceedings [SPIE International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 27 November 2000)] Microelectronic Yield, Reliability, and Advanced Packaging - Resistance degradation in early stage of electromigration of Al(Cu) metal lines
Guo, Qiang, Lo, Keng F., Manna, Indrajit, Zeng, Xu, Jie, Bin B., Tan, Cher Ming, Peng, Yeng-Kaung, Mahalingam, Mali, Prasad, KrishnamacharVolume:
4229
Year:
2000
Language:
english
DOI:
10.1117/12.404878
File:
PDF, 220 KB
english, 2000