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SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 22 February 2009)] Design for Manufacturability through Design-Process Integration III - Circuit-topology driven OPC for increased performance/yield ratio
Singh, Vivek K., Pierzchala, Edmund, Pikus, Fedor, Rieger, Michael L., Torres, J. AndresVolume:
7275
Year:
2009
Language:
english
DOI:
10.1117/12.814367
File:
PDF, 1.96 MB
english, 2009