(Invited) Characteristics of a Wire-Bonding-Less SiC Power Module Operating in a Wide Temperature Range
Sato, S., Tanisawa, H., Anzai, T., Takahashi, H., Murakami, Y., Kato, F., Watanabe, K., Sato, H.Volume:
69
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/06911.0123ecst
Date:
October, 2015
File:
PDF, 1.69 MB
english, 2015