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SPIE Proceedings [SPIE Advanced Microelectronic Manufacturing - Santa Clara, CA (Sunday 23 February 2003)] Process and Materials Characterization and Diagnostics in IC Manufacturing - Novel technique for contamination analysis around the edge, the bevel, and the edge exclusion area of 200 and 300mm silicon wafers
Sparks, Chris M., Gondran, Carolyn, Lysaght, Patrick S., Donahue, John T., Tobin, Jr., Kenneth W., Emami, IrajVolume:
5041
Year:
2003
Language:
english
DOI:
10.1117/12.485233
File:
PDF, 277 KB
english, 2003