Mechanical analysis of wafer testing with FEM simulations

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Microelectronics Reliability 2016 / 6

Mechanical analysis of wafer testing with FEM simulations

Brezmes, Angel Ochoa, Breitkopf, Cornelia
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.06.006
Date:
June, 2016
File:
PDF, 5.61 MB
english, 2016
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