Interplay between grain boundary segregation and electrical...

Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys

Kim, Gyuseok, Chai, Xuzhao, Yu, Le, Cheng, Xuemei, Gianola, Daniel S.
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Volume:
123
Language:
english
Journal:
Scripta Materialia
DOI:
10.1016/j.scriptamat.2016.06.008
Date:
October, 2016
File:
PDF, 1.45 MB
english, 2016
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