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Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys
Kim, Gyuseok, Chai, Xuzhao, Yu, Le, Cheng, Xuemei, Gianola, Daniel S.Volume:
123
Language:
english
Journal:
Scripta Materialia
DOI:
10.1016/j.scriptamat.2016.06.008
Date:
October, 2016
File:
PDF, 1.45 MB
english, 2016