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SPIE Proceedings [SPIE Integrated Optoelectronic Devices 2004 - San Jose, CA, United States (Monday 26 January 2004)] Photonics Packaging and Integration IV - Cost-effective packaging of laser modules using LTCC substrates
Keranen, Kimmo, Heyler, Randy A., Chen, Ray T., Makinen, Jukka-Tapani, Heilala, Juhani, Vaatainen, Otso, Kautio, Kari, Ollila, Jyrki, Petaja, Jarno, Karppinen, Mikko, Heikkinen, Veli, Karioja, PenttiVolume:
5358
Year:
2004
Language:
english
DOI:
10.1117/12.528280
File:
PDF, 441 KB
english, 2004