SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California (Sunday 21 February 2010)] Design for Manufacturability through Design-Process Integration IV - Exploring complex 2D layouts for 22nm node using double patterning/double etch approach for trench levels
Jessen, Scott W., Rieger, Michael L., Thiele, Joerg, Prins, Steven L., Blatchford, James W., Dillon, Brian W., Progler, Christopher J.Volume:
7641
Year:
2010
Language:
english
DOI:
10.1117/12.848350
File:
PDF, 7.09 MB
english, 2010