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ChemInform Abstract: Evaluation of Titanium as a Diffusion Barrier Between Aluminum and Silicon for 1.2 μm CMOS Integrated Circuits.
FARAHANI, M. M., TURNER, T. E., BARNES, J. J.Volume:
19
Journal:
ChemInform
DOI:
10.1002/chin.198809392
Date:
March, 1988
File:
PDF, 138 KB
1988