Damage mechanics of electromigration in microelectronics...

Damage mechanics of electromigration in microelectronics copper interconnects

Basaran, Cemal, Lin, Minghui
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Volume:
1
Year:
2007
Language:
english
Journal:
International Journal of Materials and Structural Integrity
DOI:
10.1504/ijmsi.2007.013864
File:
PDF, 736 KB
english, 2007
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