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SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Spin-on-glass (SOG) partial etch-back planarization process with 0.4-um gap filling ability
Bacchetta, Maurizio, Zaccherini, Chiara, Chen, Fusen E., Murarka, Shyam P.Volume:
2335
Year:
1994
Language:
english
DOI:
10.1117/12.186064
File:
PDF, 766 KB
english, 1994