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SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V - Characterization of sub-0.18-μm critical dimension pattern collapse for yield improvement
Zhong, Tom X., Gurer, Emir, Lee, Ed C., Bai, Hong, Gendron, Bill, Krishna, Murthy S., Reynolds, Reese M., Toprac, Anthony J., Dang, KimVolume:
3882
Year:
1999
Language:
english
DOI:
10.1117/12.361304
File:
PDF, 561 KB
english, 1999