![](/img/cover-not-exists.png)
SPIE Proceedings [SPIE International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 27 November 2000)] Microelectronic Yield, Reliability, and Advanced Packaging - Low-cost wafer level packaging process
Kapoor, Rahul, Khim, Swee Y., Hwa, Goh H., Tan, Cher Ming, Peng, Yeng-Kaung, Mahalingam, Mali, Prasad, KrishnamacharVolume:
4229
Year:
2000
Language:
english
DOI:
10.1117/12.404877
File:
PDF, 1.47 MB
english, 2000