A design of a new miniature device for solder joints...

  • Main
  • 2016 / 06
  • A design of a new miniature device for solder joints...
ARCHIVE Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science 1989-1996 (vols 2016 / 06

A design of a new miniature device for solder joints mechanical properties evaluation

Tao, Q.-B., Benabou, L., Vivet, L., Tan, K.-L., Morelle, J.-M., Le, V.-N., Ben Ouezdou, F.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Language:
english
Journal:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science
DOI:
10.1177/0954406216654728
Date:
June, 2016
File:
PDF, 2.01 MB
english, 2016
Conversion to is in progress
Conversion to is failed