ARCHIVE Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science 1989-1996 (vols
2016 / 06
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A design of a new miniature device for solder joints mechanical properties evaluation
Tao, Q.-B., Benabou, L., Vivet, L., Tan, K.-L., Morelle, J.-M., Le, V.-N., Ben Ouezdou, F.Language:
english
Journal:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science
DOI:
10.1177/0954406216654728
Date:
June, 2016
File:
PDF, 2.01 MB
english, 2016